Foundry

Queen's Advanced Micro-Engineering Centre houses a suite of semiconductor processing equipment which are available for customer foundry needs. The equipment set encompasses all sides of silicon processing including:

Photolithography
Nanoscribe 3D-SF/3D-MF/3D-LF true 3D printing: nm to mm scale
Chemical vapour deposition
Diffusion processes(doping and oxidation)
Etch(wet chemical etch, RIE, deep ICP etching)
Metalisation
Test and Analysis
Chemical Mechanical Polishing

Follow the Foundry Link for more details of what is on offer.

A copy of the QAMEC Brochure can be found by following the link: publisher pdf

For further information contact the QAMEC manager.

Process Available	Wafer Size
	75mm	100mm	150mm	200mm
LPCVD Poly silicon	×	×	×
PECVD Oxide/Nitride Deposition	×	×	×	×
Layer Analysis: Keyence 6000X 4K digital microscope/White light interferometry/Layer Thickness measurement.	x	x	x	x
PVD Metal Deposition	×	×	×
Thermal Processing: Wet and Dry Oxidation.	×	×	×
3D nanoscale printing: Nanoscribe Photonic Professional GT	3D Polymer Printing from nm to micron scale (Contact for details)
Chemical Mechanical Polishing (contact for information)	×	×	×	×
ALD Al₂O₃, HfO₂	×	×	×
Optical Lithography >4µm feature size	×	×	×
Photoresist Coat and Develop	×	×	×	×
EV Double Sided Aligner	×	×	×
RIE IE of Si₃N₄,SiO₂	×	×	×
ICP Deep Etch	×	×	×	×
Oxide wet Etch	×	×	×	X
Poly Wet Etch	×	×	×	×
Metal Wet Etch	×	×	×	×
Wet Processing	×	×	×	×
Surface Treatment	×	×	×	×
Evaporation	×
Surface and Thin Film Measurement	x	x	x	x
Measurement and Test	x	Test include CV, IV, Transistor characteristics etc/ Gas chromotography

Queen's Advanced MicroEngineering Centre

Foundry

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