Two TESCAN LYRA3* Dual beam focused ion beam scanning electron microscopes

FIB 1:

Features:

• Electron beam accelerating voltage: 200 V – 30 kV
• Ion beam accelerating voltage: 0.5 – 30 kV
• In-situ micromanipulator.
• Secondary and backscattered electrons detectors.
• Ion beam lithography

Applications:

• Micro patterning (milling/depositing)
• In-situ and ex-situ TEM sample preparation.
• Cross-sectional milling and imaging for metrology, failure analysis, etc.

FIB 2:

Features:

• Electron beam accelerating voltage: 200 V – 30 kV
• Ion beam accelerating voltage: 0.5 – 30 kV
• In-situ micromanipulator.
• Oxford X-Max50 for EDX analysis (50mm2 active area SDD)
• Oxford Nordlys EBSD detector: grain size & orientation, phase identification, etc.
• Secondary and backscattered electrons detectors.

Applications:

• Morphology: nano particles, grain size, surface, grain size, film size, etc.
• Chemical analysis and elemental distribution: alloys, catalyst, ceramics, composites, etc.
• TEM sample preparation.
• Cross-sectional milling and imaging for metrology, failure analysis, etc.

_{*LYRA3 is a dual beam system that combines a high-resolution FE-SEM column with a versatile high-performance Ga ion source FIB}